Sciperio and Embry-Riddle Collaborate to Design
High-Reliability Interconnects for Space Applications
Sciperio, an innovative research company, was awarded a Small Business Innovation Research (SBIR) phase 1 project from NASA to design high-reliability interconnects that can withstand temperature changes. Interconnects are the connections between different parts in advanced integrated electronic circuits, potentially providing solutions for applications in satellite electronics, wearable monitoring devices, and medical devices. Sciperio will work with Embry-Riddle Aeronautical University’s Wireless Devices and Electromagnetics Laboratory (WiDE Lab), use nScrypt’s high precision motion platform to manufacture test circuits that will undergo environmental evaluation.
nScrypt’s factory in a and in particular, use of their patented SmartPump technology, will provide the ability to connect to various integrated circuits in planar and conformal designs. For space applications, where volume is at a premium and the environmental conditions are harsh, advanced packaging techniques made possible through the multi process capability of the system are truly enabling and critical for reliable, high-density circuits. Sciperio is already using this technology to demonstrate 3D manufacturing of CubeSats for Space Force where the electronics are embedded into the structure of the satellite to reduce weight and volume while allowing for increased functionality.
The award was one of 300 annual project proposals selected by NASA and notably, one of 25 cutting-edge 3D printing projects focused on either developing new additive manufacturing (AM) processes or harnessing existing 3D printing technologies to support various NASA applications, missions, space exploration systems, and aeronautics. With a total agency investment of $45 million, each proposal team will receive $150,000 to demonstrate the merit and feasibility of their groundbreaking innovations.